B R IC-08A Quickly Dot-Repairing Soldering Lug Fly-Free to Jump Wire Spot Fixing Soldering Lug For Phone Welding Plates Repair

Repair and repair spot welding pieces

Enhanced fixed pins

Ultra thin patching experience ●. Tear open protection for immediate use

Suitable for mobile phone pads of different sizes

Multiple specifications and different shapes of solder joints

Suitable for various dropped solder pads on mobile phones

Replacing traditional flying wires for seamless repair

Simply tear off the protective layer and immediately repair without any marks to achieve the original solder pad effect

In the field of repair, various pads such as 1C pads on mobile phone motherboards or mid layer CPUs/WiFI hard drives/large audio/touch 1C/on double-layer motherboards are used to achieve the original pad effect and make the pads more stable due to dropping, shaking, or squeezing causing pad drops!